SD与SEM有区别吗

SD与SEM有区别吗,第1张

SD是标准偏差,反映的是样本变量值的离散程度。SEM是标准误差,反映的是样本均数之间的变异。

SD为样本标准差 ,根据标准差SD能反映变量值的离散程度 。正负值就是在计算好的SD上加个正负号, 表示在这个范围内波动;在平均值上加上或者减去这个数字,都认为在正常范围内 。

标准差的统计学常用符号为s,医学期刊常用SD表示。标准差是一个极为重要的离散度指标,常用于表示变量分布的离散程度 。对于一组变量,只用平均数来描写其集中趋势是不全面的,还需要用标准差来描写其离散趋势。标准差用公式表示为:s= ∑(x-ˉx) 2 n-1由上式可见,标准差的基本内容是离均差,即(x-ˉx)。它说明一组变量值(x)与其算术均数(ˉx)的距离,故能描述变异大小。s小表示个体间变异小,即变量值分布较集中、整齐s大表示个体间变异大,即各变量值分布较分散。

SEM是样品标准差,即样本均数的标准差,是描述均数抽样分布的离散程度及衡量均数抽样误差大小的尺度,反映的是样本均数之间的变异。标准误用来衡量抽样误差。标准误越小,表明样本统计量与总体参数的值越接近,样本对总体越有代表性,用样本统计量推断总体参数的可靠度越大。因此,标准误是统计推断可靠性的指标。

拓展资料

生物统计学是生物数学中最早形成的一大分支,它是在用统计学的原理和方法研究生物学的客观现象及问题的过程中形成的,生物学中的问题又促使生物统计学中大部分基本方法进一步发展。生物统计学是应用统计学的分支,它将统计方法应用到医学及生物学领域,在此,数理统计学和应用统计学有些重叠。

参考资料百度百科—生物统计学

如果不选open,应该是不要版面费的,你可以询问一下编辑。

期刊名 semiconductor science and technology 出版周期: 月刊

中科院杂志分区 材料科学:综合分类下的 3 区期刊

近四年SCI 影响因子:

2013年度 2012年度 2011年度 2010年度

2.206 1.921 1.723 1.323

出版社或管理机构 杂志由 IOP PUBLISHING LTD 出版或管理。ISSN号:0268-1242

杂志简介/稿件收录要求 Subject coverage. Experimental and theoretical studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductorscomputational semiconductor physicsinterface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctionsall multi-layered structures involving semiconductor components. Dopant incorporation. Growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniquesin situ monitoring of epitaxial growth processes, also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. Physics of semiconductor electronic and optoelectronic devices, including theoretical modelling and experimental demonstrationall aspects of the technology of semiconductor device and circuit fabrication. Relevant areas of 'molecular electronics' and semiconductor structures incorporating Langmuir- Blodgett filmsresists, lithography and metallization where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterization of materials and device structures. Materials and device reliability: reliability evaluation of technologiesfailure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniquesliquid crystal techniquesnoise measurement, reliability prediction and simulationreliability indicatorsfailure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migrationpackage- related failure mechanismseffects of operational and environmental stresses on reliability. Papers will normally be categorized under one of four headings: electrical and optical properties, devices, crystal growth and materials, and reliability.

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