还是英语翻译，您翻译的特别棒，佩服，麻烦您再给我翻译几段

3.4 Wear Mechanism

3.4磨损机理

SEM images of the cutting inserts were taken and evaluated to assess more

切削刀片的SEM图像和评估更多

effectively the determination of wear mechanisms occurring in the cutting

有效的切削磨损机制发生的测定

experiments and establishing wear types and consequent better evaluation of tool

实验和建立的磨损类型和随之而来的更好的评价工具

performance

性能

In Figure 5, the wear status of the ceramic insert with cutting parameters of Vc:

在图5中，参数的VC切割的陶瓷刀片的磨损状况：

300 m/min., f: 0.15 mm/rev., and ap: 0.4 mm. In the figure, flank wear, crater

300米/分钟，F：0.15毫米/转，和AP：0.4毫米。在图中，后刀面磨损，坑

wear, notch wear, and the molten chip and adhered chip on to the crater surface at

磨损，沟槽磨损，和熔融芯片粘贴芯片在火山口面

the region where the chip surface and the insert diameter ends (where the contact

所在地区的芯片表面和插入直径两端（其中接触

of the chip with the cutting insert ends) can be seen clearly. In other studies on the

与切削刀片两端的芯片）可以清楚地看到。在其他的研究

turning of hard pieces, similar results are seen [10, 9]. When the figure is studied,

硬件车削，也观察到相似的结果[ 10，9 ]。当图形研究，

it seems possible that some indent wear shall occur after some more cutting on

这似乎是可能的，一定要穿一些切割缩进后发生

this area. Abrasion marks that are the result of the abrasive wear mechanism

这一地区。这是磨料磨损机制的结果磨痕

caused by the hard martensite particles inside the work piece were small [5]. The

在工件的硬质马氏体引起的颗粒很小[ 5 ]。的

flank wear occurrence is quite small. When the crater wear at the chamfer area of

后刀面磨损的发生是相当小的。当在倒角区域的磨损

the cutting insert is studied, it can be said that the crater size shall grow if the

该切削刀片的研究，可以说，火山口的大小会变得如

cutting process is continued. The main reason for crater wear is the sliding of the

切割过程继续。为月牙洼磨损的主要原因是该滑动

chip on the chip surface of the tool. The sliding movement abrades the rises and

在工具芯片表面的芯片。滑动磨损的上升

decreases the waviness of the surface [5]. Also, the presence of chip pieces

降低表面波纹度[ 5 ]。同时，碎片的存在

adhering on the crater surface can be observed. These adhering pieces break

附着在火山口的表面可以观察到。这些粘合片打破

during the ongoing cutting process and new pieces adhere to the emptied area.

正在进行的切割工艺和新的作品在坚持空区。

Abrasion gains acceleration after this point. However, the contact inside the crater

磨损后加速这一点收获。然而，陨石坑内的接触

at high cutting speeds is evaluated through the combination of very high

在高的切削速度是通过组合评价很高

temperature, great chip sliding speed and the adhering and accumulation of chips

温度，大芯片的滑动速度和坚持和积累筹码

[9]. The adhering layers may also have a protective effect [9]. Looking at the wear

[ 9 ]。粘合层也有一定的保护作用[ 9 ]。看着穿

area in general, it can be said that effects of slightly abrasive and intensely

在一般地区，可以说是轻微的磨粒和强烈的影响

adhesive and diffusion wear mechanism are seen in the ceramic cutter.

粘接和扩散磨损机理在陶瓷刀见。

In Figure 6 is given the SEM image taken after the experiment carried out with

图6给出了实验后进行了扫描电镜图像

CBN cutting insert at cutting conditions of Vc: 300 m/min., f: 0.15 mm/rev., and

CBN刀片在VC的切削条件：300米/分钟，F，和0.15毫米/转。

ap: 0.4 mm. Flank wear, crater wear, newly developing notch wear, molten chip,

美联社：0.4毫米。后刀面磨损，磨损，新兴的缺口磨损，熔片，

and adhered chip on to the crater surface are observed. When the flank wear areas

粘贴芯片对陨石坑的表面观察。当后刀面磨损区域

are studied, chips smeared under the effects of friction and pressure can be seen as

进行了研究，芯片上摩擦和压力的作用下可以看到的

well as abrasion wear marks formed in the cutting direction cutting. Crater wear is

以及磨损标记在切割方向的切割形成的。月牙洼磨损是

observed at high cutting speeds. The reason for this may be the fact that the

在高的切削速度的观察。这也许是事实

carbides in the hardened work piece separate the bonds of the CBN binder and

在硬化工件碳化物单独的CBN粘合剂债券

abrade the tool [2].

研磨工具[ 2 ]。

祝你英语学习成功！

~~~~~~~~~~~~~~~~~~~~~

如有疑问请继续追问，望采纳，谢谢，您的采纳是我的力量！

如果我没有弄错的话BT50 SEM 32*75 你这个是BT50的刀杆，筒夹使用ER32 刀杆悬深75

HSK A63ER 30*100 这个是HSK63的主轴，筒夹是ER32 刀具悬深100

T490 LNMT 1306 pntr IC908 这个感觉像刀片的型号 在网上查了一下，确定为伊斯卡的刀片

HM90 E90A-016-2-C16 这个应该是90度铣刀；两刃，柄径为16.装上刀片后的切削直径也是16

---