营销的手段有哪些？

网络营销方法一：提供优质的顾客服务，提高销售额

网络营销的信息沟通是双向互动性和信息阅读可读性，在这过程中同时具备选择性与便捷性。在网上营销过程中的企业可有效的针对性潜在客户和目标顾客，提供优质售前和售后服务。

从而建立起企业与顾客紧密相接的关系，留住原有的老顾客更能吸引新顾客购买产品。对于企业优质服务满意的顾客自然是乐于购买和使用企业相关的产品，从而实现通过网上服务达到增加企业销售额的目的。

网络营销方法二：更新产品信息，挖掘购买者消费欲望,企业可以利用网络向顾客不断地提供相关产品的信息，例如新产品使用信息，产品的新功能、新性能、节能、环保以及新颖时尚等信息，并且适时合度地更换产品新信息。

保持企业网上站点发布信息的新鲜感、吸引力与亲和力，以激发挖掘新老顾客潜在消费欲望，引导消费者去购买企业的产品，从而达到增加新产品销售的目的。

扩展资料：

营销方式技巧：

提网络营销方法一：

供优质的顾客服务，提高销售额，网络营销的信息沟通是双向互动性和信息阅读可读性，在这过程中同时具备选择性与便捷性。在网上营销过程中的企业可有效的针对性潜在客户和目标顾客，提供优质售前和售后服务。

从而建立起企业与顾客紧密相接的关系，留住原有的老顾客更能吸引新顾客购买产品。对于企业优质服务满意的顾客自然是乐于购买和使用企业相关的产品，从而实现通过网上服务达到增加企业销售额的目的。

网络营销方法二：

更新产品信息，挖掘购买者消费欲望,企业可以利用网络向顾客不断地提供相关产品的信息，例如新产品使用信息，产品的新功能、新性能、节能、环保以及新颖时尚等信息，并且适时合度地更换产品新信息。

保持企业网上站点发布信息的新鲜感、吸引力与亲和力，以激发挖掘新老顾客潜在消费欲望，引导消费者去购买企业的产品，从而达到增加新产品销售的目的。

参考资料来源：百度百科-营销方式

The newest in the Applied Materials VeritySEM product family, VeritySEM 5i CD-SEM system features first-of-its-kind, in-line, 3D capabilities for high-volume metrology of logic and memory devices at the 1xnm node and beyond. Leveraging market-leading SEMVision® G6 core technology, the new system addresses the unprecedented challenges in measuring physical dimensions posed by leading-edge geometries. Its state-of-the-art, high-resolution SEM column makes possible measurements as small as 6nminnovative image enhancement algorithms aid measurement of fine pattern details. An in-column tilt-beam enables 3D FinFET metrology, while back-scattered electron (BSE) metrology addresses high aspect ratio 3D NAND structures, and BEOL via-in-trench bottom CD and characterization metrology.

FinFETs challenge traditional metrology in such measurements as gate and fin heights, whose uniformity is critical to device performance and yield. Current in-line CD SEM technology can monitor only top-view dimension variations, not those in height and slope. The VeritySEM 5i system’s in-column beam tilt remedies these issues, enabling gate and fin heights to be calculated and controlled.As technology scales down, the aspect ratios of 3D NAND memory structures are increasing to 60:1 and beyond, making accurate measurement of the bottom CD impossible using conventional metrology. High-resolution BSE imaging enhances the signal received from within these structures, allowing the VeritySEM 5i system to “see” deep into vias and trenches for precision measurement. This capability also improves metrology for via-in-trench bottom CD in BEOL processing where the desired connectivity between underlying and overlaying metal layers must be achieved to minimize via resistance.

The VeritySEM 5i system’s exceptional in-line accuracy and process control eliminate more time-consuming and costly off-line wafer cross-sectioning while helping chipmakers to streamline process development, improve device performance and yield, and shorten ramp times to high-volume production.

The VeritySEM 5i system continues to offer hands free recipe creation and full automation. An offline recipe generator (ORG) features recipe editing capabilities via an external server, enabling multiple users to create recipes from computer-aided design offline without the need for wafers. The recipes are automatically stored in the tool database. By eliminating recipe creation time loss, the ORG enables the user to maximize the tool's utilization in production.

The tool's OPC|CheckMax is a proven solution for automating the optical proximity correction (OPC) mask qualification process. As scaling proceeds below 32nm, OPC-enhanced features are commonly incorporated into mask designs for all layers. Hundreds of CD measurements are required to verify that the features printed on the wafer are indeed what the device designers intended to produce. With a suite of proprietary algorithms, OPC|CheckMax receives input from electronic design automation systems, automatically creates CD-SEM measurement recipes, and then directs the VeritySEM 5i system to measure thousands of sites at high throughput without operator assistance.

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